Copper Anode Plate
High-purity copper anode plates for electrolytic refining, PCB copper plating, and industrial electroplating
Hazard Characteristics
Heavy object, handle with care to avoid crush injuries. May generate copper dust or fumes during mechanical processing or high-temperature melting; avoid inhalation and use appropriate personal protective equipment.
Applications
Copper anode plates with typically high copper content for electrolytic refining, PCB copper plating, surface treatment, hardware electroplating, and related copper processing. Pyrometallurgical smelting, oxidative refining, reduction control, and casting yield stable composition, regular plate geometry, and good electrical conductivity. Confirm the applicable dimensions, bath conditions, and batch documentation before use.
Electrolytic Refining
Used as the main raw material in the electrolytic refining process to produce high-purity cathode copper.
Electronic Circuits
Provides a stable copper source for PCB manufacturing and electroplating processes.
Surface Treatment & Hardware Electroplating
Ensures uniform and high-quality copper plating layers in surface finishing applications.
Copper Processing
Serves as a reliable feedstock for various downstream copper processing industries.
Key Features
Pyrometallurgical Process
Produced through smelting, oxidative refining, reduction control, and casting, ensuring stable composition.
Stable Copper Content
High typical copper content with reasonable impurity control, suitable for subsequent electrolytic refining and industrial processing.
Excellent Physical Properties
Regular plate shape and good electrical conductivity, optimizing the efficiency of electroplating and refining.
National Standard Quality Assurance
Complies with GB/T 5231-2012 Wrought copper and copper alloys — Chemical composition limits and forms of wrought products, with stable composition and reliable quality.
Product Parameters
| Element (inspection item) | Specification range | Inspection result |
|---|---|---|
| Copper + Silver (Cu+Ag) | ≥99.95% | 99.99% |
| Iron (Fe) | ≤0.0025% | 0.0008% |
| Lead (Pb) | ≤0.0030% | 0.0005% |
| Nickel (Ni) | ≤0.0030% | 0.0007% |
| Zinc (Zn) | ≤0.0030% | 0.0005% |
| Tin (Sn) | ≤0.0030% | 0.0005% |
Material Information
- Base Material
- Copper (Cu)
- Product Form
- Plate / Board
