Copper oxide powder
Electroplating copper material · High copper content, fast dissolution, stable plating bath performance, serving high-end PCB and composite copper foil precision processes
Hazard Characteristics
Characteristics: Toxic, irritating.
Applications
Copper oxide powder is an electroplating copper material with a copper oxide content of over 99.0%. Under high-magnification electron microscopy, it exhibits a microscopic honeycomb structure, uniform particle size, good solid fluidity, and fast dissolution speed. Electronic-grade copper oxide powder provides stable plating uniformity and higher production efficiency, meeting customers' higher PCB process requirements.
High-end PCB Manufacturing
High-end PCB Manufacturing
Inner layer plug hole process technology, flexible printed circuit boards, rigid printed circuit boards, and high-density interconnect (HDI) boards.
Semiconductor PKG Boards
Semiconductor PKG Boards
Provides stable plating uniformity and high purity copper source for advanced semiconductor packaging substrates.
PET Composite Copper Foil
PET Composite Copper Foil
Copper source material scenario in new energy/thin composite copper foil process routes.
Silicone Monomer Synthesis
Silicone Monomer Synthesis
Acts as a highly efficient catalyst for silicone monomer synthesis related applications.
Key Features
Advanced Technology
Prepared by industry-advanced technology and processes.
High Copper Content
High copper content safeguards more stable, precise, and greener production requirements.
Fast Dissolution
Fast acid dissolution rate and excellent plating bath dissolution rate.
Excellent Fluidity
Smooth surface, low friction, excellent fluidity.
Uniform Distribution
No agglomeration, basically circular particles, uniform particle size distribution, good powder flowability.
Industry standard certification
Compliant with HG/T 5354-2018 Industrial Active Copper Oxide — stable, reliable quality with greater assurance for your applications.
Product Parameters
| Element (inspection item) | Electronic grade specification range | Industrial grade specification range | Inspection result |
|---|---|---|---|
| Copper oxide (CuO) | ≥99.00% | ≥98.00% | 99.30% |
| Chlorine (Cl) | ≤0.0015% | ≤0.15% | 0.0005% |
| Lead (Pb) | ≤0.0005% | — | 0.00006% |
| Sodium (Na) | ≤0.0030% | — | — |
| Magnesium (Mg) | ≤0.0010% | — | 0.00004% |
| Manganese (Mn) | ≤0.0005% | — | 0.00002% |
| Iron (Fe) | ≤0.0010% | ≤0.1% | 0.00025% |
| Nickel (Ni) | ≤0.0010% | — | 0.00009% |
| Zinc (Zn) | ≤0.0010% | — | 0.00003% |
| Calcium (Ca) | ≤0.0010% | — | 0.00039% |
| Acid-insoluble matter | ≤0.003% | ≤0.15% | 0.0002% |
| Dissolution rate in acid | ≤30 s | — | 9 s |
Highlight
Manufacturing · Continuous roasting
Zhongan Copper is the only manufacturer in China equipped with a fully automatic continuous roasting furnace system for copper oxide powder production.
Core systems
- Automatic sheet cutting machine
- Fully automatic centrifuge
- Custom loading & unloading system
- Robotic arms
- Automatic palletizing
- Full-process automatic control system
From loading and unloading through packaging, the entire flow is under automated control.
Material Information
- CAS No.
- 1317-38-0
- Molecular Formula
- CuO
- Relative Molecular Weight
- 79.55
- Appearance
- Dark brown powder
- Product Form
- Powder
- Packaging
- 25kg bags, 50kg/200kg drums, and 500kg jumbo bags; custom packaging available. Secured with stretch film.
