Hazard Characteristics
Not hazardous in solid form. Machining or melting may produce dust or fumes.
Applications
Phosphor copper rod shares the same grade logic as phosphor balls—high-purity electrolytic copper with controlled phosphorus and smooth dissolution in sulfate bright acid copper. In rod form it suits continuous casting/rolling feedstock, coil packaging, and cut-to-length tank anodes while keeping baths predictable and residue manageable.
PCB & Electronic Substrates
PCB & Electronic Substrates
Rod stock for harsh acid-copper lines: FPC, rigid-flex, HDI, multilayers, and filled vias—cut or coiled delivery aligns with line-side logistics.
Decorative & Hardware
Decorative & Hardware
Bars sawn to sticks for hardware bright copper—surface-heavy jobs where steady dissolution supports cosmetic thickness and clean baths.
Automotive Electronics
Automotive Electronics
Automotive connectors and busbars benefit from rod stock that programs into repeatable cut weights, aiding uniform deposit control in long runs.
Industrial Interconnects
Industrial Interconnects
Distributors and downstream copper shops use rod as semi-finished feed alongside plated parts production and alloy preparation programs.
Key Features
High Purity
Made from high-purity electrolytic copper with extremely low impurities, ensuring a clean plating bath.
Uniform Phosphorus Distribution
Even phosphorus distribution ensures smooth anode dissolution and minimizes anode slime generation.
Precise Phosphorus Control
Phosphorus is customizable on demand: typically 0.025%–0.055%, extendable to 0.1%–0.3%, monitored end-to-end with regular high-precision chemical analysis.
Excellent Stability
Dense crystallization provides outstanding plating stability in sulfate bright copper plating systems.
Product Parameters
| Element (inspection item) | Specification range | Inspection result |
|---|---|---|
| Copper + Silver (Cu+Ag) | ≥99.95% | 99.99% |
| Iron (Fe) | ≤0.0025% | 0.0008% |
| Lead (Pb) | ≤0.0030% | 0.0005% |
| Nickel (Ni) | ≤0.0030% | 0.0007% |
| Zinc (Zn) | ≤0.0030% | 0.0005% |
| Tin (Sn) | ≤0.0030% | 0.0005% |
Highlight
Quality · R&D
Zhongan Copper invests substantial R&D funding in quality monitoring and continuous improvement.
Primary analytical instruments
- SPECTRO (Germany) direct-reading spectrometer
- Thermo Fisher Scientific iCAP PRO ICP-OES (United States)
- ICE300 series AAS atomic absorption spectrometer
Supporting lab instruments
- Small melting furnace
- Spectrophotometer
- Analytical balance
Together these capabilities ensure rigorous detection and control of chemical composition across copper raw materials, work-in-progress, and finished products.
Material Information
- Base Material
- High-purity electrolytic copper
- Product Form
- Cylindrical / Rod
- Common Sizes
- Custom sizes available
- Packaging
- Carton / Strapping / Coiled packaging
Certificates & Reports
Chemical composition is identical; refer to Phosphor Copper Ball report.
