Oxygen-free copper rod
High-purity oxygen-free copper rod for precision conductors and downstream drawing.
Hazard Characteristics
Not hazardous in solid form. Machining or melting may produce dust or fumes.
Applications
Oxygen-free copper rod with typical Cu+Ag above 99.99%, refined under strict quality control; vacuum-related processing yields very low oxygen and a fine cast structure—suited to electronics, high-end finishing, semiconductors, and plate-making where consistency matters.
Applications
Applications
Primarily for electronic circuits, high-end surface finishing, semiconductor-related fabrication, and plate-making workflows.
Key Features
Characteristics
High purity and excellent stability.
Quality control
We tighten batch-to-batch consistency through full-process inspection so every bar meets our stated quality standards.
Custom service
Machining to drawings, dimensions, and specifications—delivering copper rod that fits your downstream process.
National standard quality assurance
Compliant with GB/T 5231-2012 Chemical Composition and Product Forms of Processed Copper and Alloys — consistent composition, dependable quality.
Product Parameters
| Element (inspection item) | Specification range | Inspection result |
|---|---|---|
| Copper + Silver (Cu+Ag) | ≥99.95% | 99.99% |
| Iron (Fe) | ≤0.0025% | 0.0008% |
| Lead (Pb) | ≤0.0030% | 0.0005% |
| Nickel (Ni) | ≤0.0030% | 0.0007% |
| Zinc (Zn) | ≤0.0030% | 0.0005% |
| Tin (Sn) | ≤0.0030% | 0.0005% |
Material Information
- Primary material
- Electrolytic copper
