Phosphor copper balls
Premium sulfate bright copper plating anode material with uniform phosphorus distribution, providing stable plating for high-end PCB and precision surface finishing.
Hazard Characteristics
Not hazardous in solid form. Machining or melting may produce dust or fumes.
Applications
Phosphor copper balls for sulfate bright acid copper: high-purity electrolytic copper, controlled phosphorus, and smooth dissolution for stable baths and low sludge. Suited to fine-line PCBs, IC substrates, decorative hardware, and automotive or industrial interconnect plating.
PCB & Electronic Substrates
PCB & Electronic Substrates
FPC, rigid-flex, HDI, multilayers, vias; IC substrates and packaging bright copper.
Decorative & Hardware
Decorative & Hardware
Hardware and sanitary bright copper—appearance and steady baths.
Automotive Electronics
Automotive Electronics
Automotive power/signal connectors—uniform deposits, stable baths.
Industrial Interconnects
Industrial Interconnects
Industrial terminals, connectors, and bright copper lines.
Key Features
High Purity
Made from high-purity electrolytic copper with extremely low impurities, ensuring a clean plating bath.
Uniform Phosphorus Distribution
Even phosphorus distribution ensures smooth anode dissolution and minimizes anode slime generation.
Precise Phosphorus Control
Phosphorus is customizable on demand: typically 0.025%–0.055%, extendable to 0.1%–0.3%, monitored end-to-end with regular high-precision chemical analysis.
Excellent Stability
Dense crystallization provides outstanding plating stability in sulfate bright copper plating systems.
Product Parameters
| Element (inspection item) | Specification range | Inspection result |
|---|---|---|
| Copper (Cu) | ≥99.90% | 99.95% |
| Phosphorus (P) | 0.040%–0.065% | 0.044% |
| Iron (Fe) | ≤0.0025% | <0.001% |
| Lead (Pb) | ≤0.0030% | <0.001% |
| Nickel (Ni) | ≤0.0030% | <0.001% |
| Zinc (Zn) | ≤0.0030% | <0.001% |
| Tin (Sn) | ≤0.0030% | <0.001% |
Highlight
Quality · R&D
Zhongan Copper invests substantial R&D funding in quality monitoring and continuous improvement.
Primary analytical instruments
- SPECTRO (Germany) direct-reading spectrometer
- Thermo Fisher Scientific iCAP PRO ICP-OES (United States)
- ICE300 series AAS atomic absorption spectrometer
Supporting lab instruments
- Small melting furnace
- Spectrophotometer
- Analytical balance
Together these capabilities ensure rigorous detection and control of chemical composition across copper raw materials, work-in-progress, and finished products.
Material Information
- Base Material
- High-purity electrolytic copper
- Product Form
- Ball / Sphere
- Common Sizes
- φ25 / φ28 / φ50 mm / Custom sizes available
- Packaging
- 25 kg/carton, heavy-duty corrugated boxes, stretch-wrapped
- Phosphorus content
- 0.025%–0.055% (Intl. Std.) 0.1%–0.3% (optional)
