Microcrystalline phosphor copper balls
Premium microcrystalline phosphor copper anode balls, engineered for high-end PCB manufacturing and precision electroplating with nanoscale lattice structure.
Hazard Characteristics
Not hazardous in solid form. Machining or melting may produce dust or fumes.
Applications
Micro-grain phosphor copper balls are designed for high-end, precision, and stable acidic copper plating. Typical application domains include PCB manufacturing, precision hardware and decorative plating, automotive electronics plating, and electroforming / precision forming in sulfate bright-copper systems. Experimental evidence shows microcrystalline phosphor copper balls can reduce overall copper consumption by more than 3%.
PCB manufacturing
PCB manufacturing
FPC, rigid-flex, HDI, multilayers, through- and blind-via filling; IC substrates and packaging bright copper—where uniform dissolution and bath stability matter most.
Precision hardware & decorative plating
Precision hardware & decorative plating
Hardware, sanitary ware, jewelry, and appearance bright copper: mirror finish, color consistency, and long-run bath stability on high-end finishing lines.
Automotive electronics plating
Automotive electronics plating
Automotive power/signal connectors and busbar bright copper—demanding uniform thickness and repeatability; micro-grain anodes help keep deposition steady.
Electroforming & precision forming
Electroforming & precision forming
Electroformed parts, mandrel build-up, and precision functional copper layers—dense, controlled deposits in sulfate bright-copper systems.
Key Features
Nanoscale Crystal Lattice
Through specific cooling and processing technologies, the crystal lattice is refined to a microcrystalline state, significantly enhancing dissolution uniformity.
High Purity & Fine Grain
Manufactured from high-purity copper with a fine, dense grain structure, minimizing anode slime and keeping the plating bath exceptionally clean.
Uniform Phosphorus Distribution
Even distribution of phosphorus prevents passivation and ensures smooth, consistent anode dissolution during extended plating cycles.
Precise Phosphorus Control
Phosphorus is customizable on demand: typically 0.025%–0.055%, monitored end-to-end with regular high-precision chemical analysis.
Exceptional Stability
Delivers outstanding plating stability, making it the ideal choice for demanding, high-precision acidic copper plating systems.
Product Parameters
| Element (inspection item) | Specification range | Inspection result |
|---|---|---|
| Copper (Cu) | ≥99.90% | 99.95% |
| Phosphorus (P) | 0.040%–0.065% | 0.044% |
| Iron (Fe) | ≤0.0025% | <0.001% |
| Lead (Pb) | ≤0.0030% | <0.001% |
| Nickel (Ni) | ≤0.0030% | <0.001% |
| Zinc (Zn) | ≤0.0030% | <0.001% |
| Tin (Sn) | ≤0.0030% | <0.001% |
Highlight
Quality · R&D
Zhongan Copper invests substantial R&D funding in quality monitoring and continuous improvement.
Primary analytical instruments
- SPECTRO (Germany) direct-reading spectrometer
- Thermo Fisher Scientific iCAP PRO ICP-OES (United States)
- ICE300 series AAS atomic absorption spectrometer
Supporting lab instruments
- Small melting furnace
- Spectrophotometer
- Analytical balance
Together these capabilities ensure rigorous detection and control of chemical composition across copper raw materials, work-in-progress, and finished products.
Material Information
- Base Material
- High-purity electrolytic copper
- Product Form
- Ball / Sphere
- Common Sizes
- φ25 / φ28 / φ50 mm / Custom sizes available
- Packaging
- 25 kg/carton, heavy-duty corrugated boxes, stretch-wrapped
- Phosphorus content
- 0.025%–0.055% (Intl. Std.) 0.1%–0.3% (optional)
